Beijing Haina Lean Technology Co., Ltd
Professional Manufactuer, Supply PCB Design,PCB Fabrication,PCB Assembly (PCBA ),Components Sourcing,Function Testing,Enclosure Assembly
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PCBA is the abbreviation of printed circuit board assembly in English, that is to say, PCB blank board is loaded by SMT, or DIP plug-in, the whole process is called PCBA, and the standard writing method is PCB in Europe and the United States, and "the" added This is called the official idiom.
We fabricate PCB Assembly with SMT,DIP, BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .
We can produce and offer bulk volume printed circuit boards to meet your requirements. Each PCB goes through a strict testing process, ensuring that quality is never compromised. For high-volume PCBA order, we offer competitive pricing, as well as flexible shipment plans to you.
| FACTORY CAPABILITIES | |||
| No. | Items | 2019 | 2020 |
| 1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
| 2 | Max layer count | 32L | 36L |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
| 4 | Min.Hole Size | Laser 0.075mm Mechnical 0.15 | Laser 0.05mm Mechnical 0.15 |
| 5 | Min Line Width/Space | 0.035mm/0.035 | 0.030mm/0.030mm |
| 6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
| 7 | Size Max Panel size | 700x610mm | 700x610mm |
| 8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
| 9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
| 10 | Min.BGA PAD | 0.15mm | 0.125mm |
| 11 | Max Aspect Ratio | 10:1 | 10:1 |
| 12 | Bow and Twist | 0.50% | 0.50% |
| 13 | Impedance Control Tolerance | +/-8% | +/-5% |
| 14 | Daily output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
| 15 | Surface Finishing | HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI | |
| PCBA Capability | ||||||
| Material type | PCB | Components | ||||
| Item | Dimension (Length, width,height. mm) | Material | Surface finish | Chip&IC | BGA Pitch | QFP Pitch |
| Min | 50*40*0.38 | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | HASL, OSP, Immersion gold, Flash Gold Finger | 1005 | 0.3mm | 0.3mm |
| Max | 600*400*4.2 | |||||
PCB Design & Layout
PCB Fabrication
PCB Assembly
Components Sourcing
Function Testing
Box Assembly
AL-SPI-IA
solder paste printing equipment
wave-soldering
automatic printing equipment
60times magnifying glass
material baking equipment
X-ray welding inspection
Semi-automatic printing equipment
component counting equipment
Online AOI detector
Reflow welding equipment
Mydata welding equipment
PCB Assembly are mainly used for many communication industry, medical equipments, consumer electronics ,automotive electronics , Elevator,audio and video, optoelectronics, robotics, hydroelectric power, Elevator,aerospace, education, power supply, printer ,Auto Industry ,Smart Home.etc.