Beijing Haina Lean Technology Co., Ltd
Professional Manufactuer, Supply PCB Design,PCB Fabrication,PCB Assembly (PCBA ),Components Sourcing,Function Testing,Enclosure Assembly
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The processing of PCBA is very complicated, including many important processes such as PCB manufacturing process, component procurement and inspection, SMT assembly, DIP welding, PCBA testing and so on. Among them, PCBA testing is the most critical quality control step in the entire PCBA processing. The test determines the final performance of the product. Haina Lean provides you with high-quality and assured products.
| FACTORY CAPABILITIES | |||
| No. | Items | 2019 | 2020 |
| 1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
| 2 | Max layer count | 32L | 36L |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
| 4 | Min.Hole Size | Laser 0.075mm Mechnical 0.15 | Laser 0.05mm Mechnical 0.15 |
| 5 | Min Line Width/Space | 0.035mm/0.035 | 0.030mm/0.030mm |
| 6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
| 7 | Size Max Panel size | 700x610mm | 700x610mm |
| 8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
| 9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
| 10 | Min.BGA PAD | 0.15mm | 0.125mm |
| 11 | Max Aspect Ratio | 10:1 | 10:1 |
| 12 | Bow and Twist | 0.50% | 0.50% |
| 13 | Impedance Control Tolerance | +/-8% | +/-5% |
| 14 | Daily output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
| 15 | Surface Finishing | HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI | |
| PCBA Capability | |||
| Material Type | Item | Min | Max |
| PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
| Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | ||
| Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
| Components | Chip&IC | 1005 | 55mm |
| BGA Pitch | 0.3mm | - | |
| QFP Pitch | 0.3mm | - | |
Printed circuit boards And PCB Assembly are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.
PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box